Inquiry (采购产品): WAFER GOLD PLATING PLANT We are one of the Plating/ Metal Finishing Equipments manufacturing companies in India. One of our enquiries on hand is for: The plating systems should have the capability to carry out electro-plating of Gold and Ni-Fe(81:19) (permalloy) on 4” diameter silicon wafer in a thick positive Photoresist(PR) mould or Benzocyclobutene(BCB) mould. Typical pattern width is 10 to 30 μm and depth which has to be filled is 25 to 100 μm. The electroplating process temperature is 50-60OC. The design of the tank and other accessories should be such that it should withstand this temperature. The system should have the provision to do plating of one such wafer at a time. The whole system consists of process tank, a process pump, heater, filter, sample holder and control electronics. The system may be placed inside a PP bowl to prevent chemical spillage and should be class 1000 compatible. The system should be compact, rugged and reliable. There must be provision for circulation of electrolyte and filtration. Each plating material should have own process tank and circuit to avoid cross contamination. The electroplating of gold and permalloy on processed silicon wafer has to be demonstrated by the supplier at OUR CLIENT. Should you be interested in quoting through us, we will mail detailed specifications of the system. Quote will be very urgent within week end. **** Hidden Message ***** KUMAR BESPL WA 560079 IND Company: BESPL E-mail: besplating@gmail.com **** Hidden Message ***** besplating@gmail.com
