Inquiry (采购产品): Quote Request 11409 Valley View Road Eden Prairie, MN 55344 Phone: (952) 829-9217 Fax: (952) 996-1600 REQUEST FOR QUOTE Metalized Ceramic Substrate NVE, INC. needs a ceramic substrate approximately 0.3 x 1.6" for development testing of individual parts in ULLGA (4 pins) and TDFN6 (6 pins) packages. The substrate will require metal traces for attachment of wires to contact the package pins. The metallization will be suitable for solder reflow attachment of parts to the substrate. Our company produces magnetic sensors and many of the products are put into very small plastic packages. We often need to test them at temperatures that are higher than standard FR4 PCB materials will tolerate. The metalization pattern will be the “footprints” of two of the smaller plastic packages we use (one footprint on either side of the substrate). One package is the 1.1mm sq., 4 lead Ultra Leadframe Land Grid Array (ULLGA) package; the other is the 2.5mm sq. 6 lead Thin Dual-in-line Flat No-lead (TDFN) package. Both are no-lead Surface Mount Devices (SMD). (See Figures 2 and 3 below.) Each footprint pad will be brought out to a plated through hole for the addition of wires to contact each package pin. (See figures 1 and 4 below) Both sides will use the same holes because only one side would be used on a given substrate. This negates the need for two separate substrates. A gerber file for the metallization pattern and text layers will be provided at order placement. Please contact me if you have any questions regarding this RFQ. (Contact information is at the end of this RFQ.) SPECIFICATIONS: Substrate size: Approximately 0.3 inches wide by approximately 1.6 inches long (dimensions not critical) Substrate thickness: 40 mils minimum (only consideration is fragility) Metalization: Suitable for solder reflow oven method of SMD mounting (i.e., gold or gold plated) Layout Layers: 2 metalized patterns, one on the top, a different one of the bottom, plus a text layer Minimum metalization line width: 8 mils (6 mils preferred) Through hole diameter: Approximately 50 mills Quantity: Please quote 100ea., 200ea. and/or price breaks near those quantities FIGURES (For illustrative purposes only) Figure 1. Photo of an existing FR4 epoxy/fiberglass PCB of a similar layout. Figure 2. TEFN6 Outline Drawing (Note pad placement and size.) Figure 3. ULLGA outline drawing (Note pad placement and size.) Figure 4. Drawing/sketch of patterns to be placed on ceramic substrate (Approximately to scale) CONTACT INFORMATION Rick Rasmussen Sensor Product Engineer NVE Corp - Phone: (952) 996-1606 - Fax: (952) 829-9189 - Email: rrasmuss@nve.com REQUEST FOR QUOTE ADDENDUM Metalized Ceramic Substrate The following information is given in response to questions fielded with respect to this RFQ: 1. A solder mask can also work as the text layer. A separate layer is not necessary (can be omitted altogether). 2. Drawing file. We can provide either Gerber or DXF format. We don’t have a layout yet. We want to wait until we have the design rules for the suppliers process first. If you cannot make a firm quote because of the lack of a drawing/file, just leave that part as an estimate on the quote. 3. NVE makes magnetic sensors so the board metallization cannot contain magnetic (perming) materials such as iron or nickel. 4. The wires to be connected to the boards will typically be standard 24 AWG stranded wire for connection to test equipment. The boards are for testing in a development lab. The wires will be soldered to the boards (sometimes leaded solder, sometimes lead free). **** Hidden Message ***** Rick Rasmussen 55362 USA Company: NVE Corp E-mail: rrasmuss@nve.com **** Hidden Message ***** rrasmuss@nve.com
