Inquiry (采购产品): MEMs testing I need help testing a MEMS pressure sensor chip. The device is a single die manufactured by etching and implanting on a silicon wafer. The 2 mm die is mounted on a ceramic test substrate 1.5 x 2.5 cm. The finished die has an anodic bonded glass top and bottom layers. Essentially a silicon sandwich with glass on both sides. The passive resisters on the die are protected or covered by field shields. What I am trying to do is determine how large of an AC field or Magnetic field is needed to induce a current in the field shield that will cause damage to the device. I hypothesize the induced current will cause a break thru in an adjacent oxide layer. I need a service to provide the fairly high AC or Magnetic field for inducing an inductive current. I can test the performance of my device before and after exposure. Can you help or offer a suggestion? **** Hidden Message ***** David Craft 95035 Company: SMI E-mail: david.craft@si-micro.com **** Hidden Message ***** david.craft@si-micro.com
