Inquiry (采购产品): In bumps After depositing In using sputtering technique, I reflowed the sputtered In layer at 156C inside the spuutering deposition system's chamber. The In reflowed (smelt) but I always have many unwanted In bumps. Is it normal or due to the purity of the In target? How can I avoid having these bumps. Thanks. **** Hidden Message ***** Tuoc Dang 45433 USA Company: Wright Patterson Air Force Base E-mail: tuoc.dang@wpafb.af.mil **** Hidden Message ***** tuoc.dang@wpafb.af.mil
