melting of bonding materials for the target from your compan
01-10 09:37:24 来源： 作者：
melting of bonding materials for the target from your compan
This is an inquiry message about melting of bonding materials for the target from your company in the 108th China Canton Fair. (这是一条买家关于"melting of bonding materials for the target from your company"的询盘信息，来自第108届中国广交会。)Inquiry Message (询盘信息) melting of bonding materials for the target from your company Dear Sir or Madam, This is Jing Jiang, from Biomagnetics Lab, National University of Singapore, we have bought an IrMn (22:78 at%) target from your company, now we found there is some melting of bonding materials for this target. Now we are investigating whether this problem is caused by target or sputter system. So could you please send us some supporting documents concerning the bonding materials? We want to know the maximum power and temperature (heat) to cause the melting of your bonding materials. Please refer to the information from our sputter engineer as follows: The main cause of the melting of bonding material on your IrMn target is due to 3 possible causes. 1) Poor bonding 2) Excessive bonding material being used 3) Incorrect bonding material being used We are really urgent to clarify this problem and so could you please send us the concerning information as your earliest convenient time? Many thanks! Best regards, Jing Jing JIANG Biomagnetics Lab National University of Singapore, 117576 HP:65-93380927 OP:65-65161496 Contact Info (联系信息) Jing JIANG BLK E4, level 7, room 18 4 Engineering Drive 3 117576 SGP Company: Biomagnetics Lab, National University of Singapore Phone: 65-93380927 E-mail: g0500106@nus.edu.sg g0500106@nus.edu.sg
