This is an inquiry message about Thermal Interface Material in the 108th China Canton Fair. (这是一条买家关于"Thermal Interface Material"的询盘信息，来自第108届中国广交会。)Inquiry Message (询盘信息) Thermal Interface Material I am looking for a non-silicone based material to replace Bergquist Gap Pad VO Ultra Soft in a current application. I need equivalent or better Thermal Conductivity (1.0 W/m-K) and Hardness as close to a 5 rating on the Shore 00 scale. Contact Info (联系信息) Larry Vergon 32819 Company: Lockheed Martin MFC E-mail: larry.vergon@lmco.com larry.vergon@lmco.com
