Inquiry (采购产品): Re: Inquiry about Ceramic machining Dear Professional, I am interested in finding a way to "round" some sharp edges on AlTiC ceramic surfaces. The typical sizes of the unit to be processed is about 1200 micrometer long, 770 micrometer wide and couple hundres micrometers thick. The rounding surface roughness must be less than one nanometer and the chamferring angle with the parallel surface must be 0.5 degree +/- 3sigma. Can you kindly let me know whether it is feasible to achieve these specifications? My email is Leping.Li@seagate.com and my phone number is (952)402-7412. Hope to hear back your thought on this. Best regards. Leping Li, Ph.D. **** Hidden Message ***** Leping Li 7801 Computer Avenue Bloomington, MN 55435 USA Company: Seagate Technology Phone: 952-402-7412 E-mail: leping.li@seagate.com **** Hidden Message ***** leping.li@seagate.com
