Inquiry (采购产品): Dicing non-rectangular dies Hello, my company has traditionally made custom rectangular dies for use in a digital xray sensor. We will be shifting in a few months to a non-rectangular shape (two of the corners will be 'clipped'), and we are concerned our traditional grinding/dicing equipment in house will be ill-suited to this new contour. I am looking for a possible external vendor to dice our wafers somewhere close to New York. We expect to be dicing approximately 1000 1 x 1.5 inch dies a month for 5 years for this product, and they are on 8 inch wafers, 0.016 inches thick. Please call me to discuss the possibility of collaboration. **** Hidden Message ***** charles smith 11101 USA Company: Schick Tech Inc Phone: 718.482.2227 E-mail: csmith@schicktech.com **** Hidden Message ***** csmith@schicktech.com
