Inquiry (采购产品): hot melt application system I am looking to replace our hot melt system in the University packaging lab. Our current system is Norstrom , pneumatic, uses glue chips. This will be used for corrugated and paperboard. Please advise. Mike UW-Stout **** Hidden Message ***** Mike Sanderson 817 S. Broadway 315A Fryklund Hall Menomonie, WI 54751 USA Company: UW-Stout Title: Mechanician Phone: 715-232-5626 Fax: 715-232-1330 E-mail: sandersonm@uwstout.edu **** Hidden Message ***** sandersonm@uwstout.edu
